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Manufacturer

• Apricorn (8)
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• Centon Electronics Inc. (1)
• Cisco (13)
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• EDGE Memory (3)
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• HEWLETT PACKARD ENTERPRISE PARTS STORE (1)
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• PALO ALTO NETWORKS (1)
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• Plugable Technologies (1)
• QNAP Systems, Inc. (1)
• SYNOLOGY (5)
• Sabrent (7)
• Samsung (32)
• SanDisk Corp. (22)
• Seagate (23)
• StarTech (4)
• Transcend Information, Inc. (21)
• Visiontek (3)
• Western Digital (49)

Price

• $100 - $200 (87)
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• $3000 - $4000 (7)
• $5000 - $6000 (6)
• $10,000 and up (3)
• $6000 - $7000 (2)
• $8000 - $9000 (1)
• $9000 - $10000 (1)

Buffer Size

• 8 MB (6)
• 1 GB (2)
• 2 GB (2)
• 512 MB (2)
• 256 MB (1)
• 4 GB (1)

Color

• Black (1)
• Red (1)
• Space gray (1)

Data Transfer Rate

• 10 Gbit/s (1)
• 40 Gbps (1)

Device Type

• Solid state drive - internal (198)
• Solid state drive - hot-swap (70)
• Solid state drive - external (portable) (31)
• Hard drive - external (portable) (9)
• Hard drive - hot-swap (5)
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• Hard drive - internal (2)
• Interface adapter - external (2)
• Solid state drive - external (2)
• Storage enclosure - external (2)
• Interface adapter - plug-in card (1)
• NAS server (1)
• Network adapter (1)
• Storage controller (1)
• Storage controller (RAID) (1)
• USB drive duplicator (1)

Interface Bus Type

• PCI Express (1)

Interface Type

• SATA 6Gb/s (1)

Power Provided

• 90 Watt (1)

Product Material

• Aluminum (2)

Features

• Digitally Signed Firmware (12)
• Advanced 3D NAND Technology (7)
• nCache 4.0 technology (7)
• Microsoft DirectStorage API support (6)
• Hardware encryption, PIN code authentication, 256-bit AES-XTS (5)
• Low Endurance (5)
• 3D NAND Technology, SLC cache, exFAT formatted (4)
• NVM Express (NVMe) 1.4, S.M.A.R.T. (4)
• NVM Express (NVMe) 2.0, S.M.A.R.T. (4)
• Adaptive thermal monitoring, overhead balancing, predictive loading, Microsoft DirectStorage API support (3)
• Class 35, NVM Express (NVMe) (3)
• DDR3 DRAM Cache, Low-Density Parity Check, DevSleep mode, Native Command Queuing (NCQ), TRIM support, 3D NAND Technology, S.M.A.R.T. (3)
• Dual Port, Digitally Signed Firmware, High Performance (3)
• Intelligent TurboWrite Technology, Samsung V-NAND TLC Technology, Device Sleep support, Host Memory Buffer (HMB), TRIM support, Auto Garbage Collection Algorithm, S.M.A.R.T. (3)
• Password authentication, HFS+ formatted, LED status indicator (3)
• Password authentication, automatic backup (3)
• Password authentication, up to 3m to concrete drop protection, 256-bit AES (3)
• Shock-resistant, water-resistant, dustproof, USB Attached SCSI Protocol (UASP) compliant, Dynamic Thermal Guard protection, NVM Express (NVMe) (3)
• TRIM support, Auto Garbage Collection Algorithm, Samsung Metis Controller, Samsung V-NAND TLC Technology, S.M.A.R.T. (3)
• TRIM support, Auto Garbage Collection Algorithm, Worldwide Name (WWN), Samsung Elpis Controller, Samsung V-NAND TLC Technology, Low Power SDRAM cache, NGUID supported, S.M.A.R.T. (3)
• 24x7 continuous operation, 3D NAND Technology (2)
• 3D NAND Technology, Multistep Data Integrity Algorithm, Thermal Monitoring, SLC Write Acceleration, Active Garbage Collection, TRIM support, Error Correction Code (ECC) (2)
• Advanced format 512e (2)
• Advanced format 512n (2)
• Automatic backup, password authentication (2)
• Built-in USB hub, password authentication (2)
• Business critical, Mixed-Use (2)
• Digitally Signed Firmware, Mainstream Performance (2)
• Digitally Signed Firmware, NVM Express (NVMe), Dual Port (2)
• Dual Port, low latency (2)
• Multistep Data Integrity Algorithm, dynamic write acceleration, power loss immunity, Garbage Collection technology, TRIM support, NVMe standard Self-Monitoring and Reporting Technology ((SMART), Error Correction Code (ECC), TCG Pyrite, NVM Express (NVMe), 3D NAND Technology, S.M.A.R.T. (2)
• NVM Express (NVMe) 1.3c, Low Power DDR4 SDRAM Cache, TRIM support, Auto Garbage Collection Algorithm, sleep mode, integrated heatsink, Intelligent TurboWrite Technology, PS5 compatible, S.M.A.R.T. (2)
• NVM Express (NVMe) 1.4 (2)
• NVM Express (NVMe) 2.0, dynamic write acceleration, Multistep Data Integrity Algorithm, Adaptive Thermal Protection, power loss immunity, Active Garbage Collection, TRIM support, Error Correction Code (ECC), TCG Pyrite, S.M.A.R.T. (2)
• NVM Express (NVMe) 2.0b, Micron Secure Encrypted Environment (SEE), Self-Encrypting Drive (SED), Key-Based Firmware Update, Strong Asymmetric Key Support, Digitally Signed Firmware, Surprise Insertion capable, Surprise Removal capable, Hot-Plug Support, field-upgradeable firmware, Firmware Activate without Reset, NVMe Management Interface (NVMe-MI) 1.2b, Dynamic and Static Wear Leveling, NVME Urgent Weighted Round Robin, End-to-end data protection, Enterprise Power-Loss Protection, Read Unrecoverable Bit Error Rate (UBER) 10e-18, Open Compute Project 2.0, S.M.A.R.T. (2)
• NVM Express (NVMe), Class 40 (2)
• NVM Express (NVMe), End-to-end data protection (2)
• NVM Express (NVMe), PS5 compatible, S.M.A.R.T. (2)
• NVM Express (NVMe), water-resistant, dustproof (2)
• Non-SED, 176-layer 3D NAND technology, Adaptive thermal monitoring, Enterprise Data Path Protection, Hot-Plug Support, RAIN technology, Read Intensive, power loss data protection (2)
• Non-SED, 176-layer 3D NAND technology, Adaptive thermal monitoring, Hot-Plug Support, RAIN technology, Read Intensive, power loss data protection (2)
• Non-SED, 176-layer 3D NAND technology, Asymmetric Roots of Trust, RSA Delegation Key Support, Secure Boot, Secure Execution Environment, Strong Asymmetric Key Support (2)
• PS5 compatible, S.M.A.R.T. (2)
• Performance (2)
• Power loss data protection, Enterprise Data Path Protection, Firmware Upgrade without Reset, Secure Erase function, Secure Boot, Secure Firmware, Active Garbage Collection, TRIM support, Self-Encrypting Drive (SED), Digitally Signed Firmware, NAND Block Erase, Cryptographic Erase, DMA supported, 176-layer 3D TLC NAND technology (2)
• RAIN technology, Hot-Plug Support, power loss data protection, Thermal Monitoring, 176-layer 3D NAND technology (2)
• Supports NVM Express (2)
• TRIM support, sleep mode, Auto Garbage Collection Algorithm, eDrive, Device Sleep support, DDR4 DRAM Cache, Samsung V-NAND 3bit MLC Technology, S.M.A.R.T. (2)
• V-NAND Technology, temperature sensor, End-to-end data protection (2)
• eDrive, Host Memory Buffer (HMB), Samsung V-NAND TLC Technology (2)
• nCache 4.0 technology, Microsoft DirectStorage API support (2)
• 176-layer NAND technology, Adaptive thermal monitoring, Enterprise Data Path Protection, Hot-Plug Support, RAIN technology, Read Intensive, power loss data protection (1)
• 176-layer NAND technology, Adaptive thermal monitoring, Enterprise Data Path Protection, Hot-Plug Support, RAIN technology, power loss data protection, non-SED (1)
• 176-layer NAND technology, NVM Express (NVMe) (1)
• 24x7 continuous operation (1)
• 24x7 continuous operation, Dual Port, Seagate Secure (1)
• 3D NAND Technology (1)
• 3D NAND Technology, DRAM cache, LDPC error correction, NVM Express (NVMe) 1.3, S.M.A.R.T., AHCI (1)
• 3D NAND Technology, Halogen Free, TRIM support, NVM Express (NVMe) 1.4, S.M.A.R.T. (1)
• 3D NAND Technology, NVM Express (NVMe), S.M.A.R.T. (1)
• 3D NAND Technology, S.M.A.R.T. (1)
• 512 emulation ( 512e ) (1)
• Advanced Garbage Collection, 3D NAND Technology, RAID Engine, LDPC error correction, DRAM cache, NVM Express (NVMe) 1.3, S.M.A.R.T. (1)
• Advanced format 512e, Instant Secure Erase (ISE) (1)
• Built-in BCH ECC, Advanced Garbage Collection, LDPC error correction, S.M.A.R.T. (1)
• Built-in keypad, rugged, administrator password, auto lock, drive reset, Wear Resistant Keypad, LED status indicator, Self Destruct PIN, user forced enrollment, admin forced enrollment, Lock-Override mode, 2 Read-Only Modes, independent user and admin PINs, Brute Force Protection, Secure Firmware (1)
• Business critical, Mixed-Use, HPE Value (1)
• Business critical, Read Intensive (1)
• Class 35 (1)
• Class 40 (1)
• Digitally Signed Firmware, Dual Port (1)
• Digitally Signed Firmware, HPE Value (1)
• Dustproof, water-resistant, Apple FileVault compatible, LED status indicator (1)
• Dynamic and Static Wear Leveling, StaticDataRefresh Technology, Advanced Garbage Collection, LDPC error correction, 3D NAND Technology, Global Wear Leveling, SLC cache, NVM Express (NVMe) deallocate support, HMB (Host Memory Buffer) supported, NVMe Security Erase support, Data Shaping, IG5220 controller, S.M.A.R.T., NVMe 1.4 (1)
• Dynamic and Static Wear Leveling, StaticDataRefresh Technology, Garbage Collection technology, 3D NAND Technology, Global Wear Leveling, Low-Density Parity Check, SLC cache, ECC Recovery LDPC, Host Memory Buffer (HMB), Data Shaping, S.M.A.R.T. (1)
• Dynamic and Static Wear Leveling, StaticDataRefresh Technology, Garbage Collection technology, 3D NAND Technology, Global Wear Leveling, Low-Density Parity Check, SLC cache, ECC Recovery LDPC, Host Memory Buffer (HMB), NVMe Security Erase support, S.M.A.R.T. (1)
• Dynamic and Static Wear Leveling, StaticDataRefresh Technology, Garbage Collection technology, Error Correction Code (ECC), End-to-end data path protection, LDPC error correction, 3D NAND Technology, Global Wear Leveling, SLC cache, NVM Express (NVMe) deallocate support, HMB (Host Memory Buffer) supported, NVM Express (NVMe) 1.4, NVMe Security Erase support, InnoGrit IG5216, S.M.A.R.T. (1)
• Dynamic and Static Wear Leveling, StaticDataRefresh Technology, Garbage Collection technology, Error Correction Code (ECC), LDPC error correction, 3D NAND Technology, Low-Density Parity Check, NVM Express (NVMe), Silicon Motion controller, NVM Express (NVMe) 1.3, dynamic SLC caching, NVM Express (NVMe) deallocate support, HMB (Host Memory Buffer) supported, S.M.A.R.T. (1)
• Dynamic write acceleration, 3D NAND Technology, Microsoft eDrive compatible, power loss data protection, upgradable firmware, Redundant Array of Independent NAND, Multistep Data Integrity Algorithm, Adaptive Thermal Protection, Active Garbage Collection, TRIM support, Error Correction Code (ECC), Device Sleep support, S.M.A.R.T. (1)
• Enterprise, workload up to 550 TB per year, NAS compatible (1)
• Equipped with a security slot, automatic backup (1)
• HP Z Turbo Drive (1)
• Halogen Free, Dynamic and Static Wear Leveling, Enhanced Power Loss Data Protection, End-to-end data protection, NVM Express (NVMe) 1.4, S.M.A.R.T. (1)
• Halogen Free, TRIM support, Error Correction Code (ECC), Multistep Data Integrity Algorithm, Active Garbage Collection, upgradable firmware, 3D NAND Technology, SLC Write Acceleration, Thermal Monitoring, S.M.A.R.T. (1)
• Halogen Free, TRIM support, drop-in installation, NVMe 1.4, S.M.A.R.T. (1)
• Host Memory Buffer (HMB), TRIM support, Auto Garbage Collection Algorithm, Device Sleep support, Intelligent TurboWrite Technology, NVM Express (NVMe) 1.4, S.M.A.R.T. (1)
• Microsoft DirectStorage API support, PlayStation compatible (1)
• NVM Express (NVMe) (1)
• NVM Express (NVMe) 1.3, LDPC error correction, 3D NAND Technology, AHCI (1)
• NVM Express (NVMe) 1.4, 176-layer NAND technology, dynamic write acceleration, Host Memory Buffer (HMB), Secure Boot (1)
• NVM Express (NVMe) 1.4, 3D NAND Technology, S.M.A.R.T health information support, 3D QLC NAND, 256-bit AES (1)
• NVM Express (NVMe) 1.4, PlayStation compatible, S.M.A.R.T. (1)
• NVM Express (NVMe) 1.4, PlayStation compatible, integrated heatsink, S.M.A.R.T. (1)
• NVM Express (NVMe) 1.4, TRIM support, S.M.A.R.T. (1)
• NVM Express (NVMe) 2.0 (1)
• NVM Express (NVMe), End-to-end data protection, Power Loss Protection (PLP) (1)
• NVM Express (NVMe), Phison E18 controller (1)
• Native Command Queuing (NCQ), Rotary Acceleration Feed Forward (RAFF), Time-Limited Error Recovery (TLER), dual actuator technology, Enterprise Class Reliability, NAS compatible, 24x7 continuous operation, advanced format 512e, Dynamic fly height technology (1)
• Native Command Queuing (NCQ), TRIM support, Samsung V-NAND 3bit MLC Technology (1)
• Non-SED, 176-layer 3D NAND technology, Adaptive thermal monitoring, Enterprise Data Path Protection, Hot-Plug Support, RAIN technology, power loss data protection, Mixed-Use (1)