Tomorrow's main memory standard, Samsung DDR3, continues the performance increases and architectural improvements seen in the preceding generations of advanced computer memory. Based on the JEDEC specifications, Samsung DDR3 delivers extremely high bandwidth. Chips contain an on-die thermal sensor to facilitate system-level thermal management. Dual-gate transistors help reduce current leakage.
Samsung DDR3 modules offer better signal control than DDR2 resulting from DQ shielding, self OCD and a fly-by command/address/control bus with on-DIMM termination. DDR3's increased performance coupled with lower power requirements can benefit desktops, notebooks and servers alike.