Browse by Category

• Accessories (2)
• Desktops & Workstations (1)
• Memory (73)
• Printers, Scanners & Supplies (7)
• Storage & Backup (68)

Manufacturer

• Micron (144)
• Star Micronics, Inc. (10)

Price

• Under $100 (52)
• $100 - $200 (50)
• $200 - $300 (17)
• $300 - $400 (15)
• $1000 - $2000 (9)
• $400 - $500 (6)
• $500 - $1000 (4)
• $5000 - $6000 (1)

Device Type

• Solid state drive - internal (55)
• Solid state drive - external (portable) (11)

Features

• Unbuffered (18)
• Dual rank, unbuffered (10)
• Registered (10)
• Single rank, unbuffered (7)
• 232-layer TLC NAND technology, Microsoft DirectStorage API support, NVM Express (NVMe) 2.0 (6)
• Microsoft DirectStorage API support (6)
• Advanced 3D NAND Technology (5)
• Dustproof, water-resistant, PlayStation compatible, Xbox compatible, LED status indicator (5)
• Dual rank, registered (4)
• 232-layer TLC NAND technology (3)
• Paper out sensor, open cover sensor (3)
• Shock-resistant, vibration-resistant, impact-resistant, temperature-proof (3)
• 232-layer TLC NAND technology, Microsoft DirectStorage API support (2)
• 3D NAND Technology, Multistep Data Integrity Algorithm, Thermal Monitoring, SLC Write Acceleration, Active Garbage Collection, TRIM support, Error Correction Code (ECC) (2)
• AMD EXPO, Intel Extreme Memory Profiles (XMP 3.0), unbuffered (2)
• Aluminum heatspreader, Intel Extreme Memory Profiles (XMP 3.0), AMD extended profiles for overclocking (EXPO), unbuffered (2)
• Dual rank (2)
• Dustproof, water-resistant, Apple FileVault compatible, LED status indicator (2)
• Intel Extreme Memory Profiles (XMP 2.0), unbuffered (2)
• Intel Extreme Memory Profiles (XMP 3.0), AMD EXPO, unbuffered (2)
• Multistep Data Integrity Algorithm, dynamic write acceleration, power loss immunity, Garbage Collection technology, TRIM support, NVMe standard Self-Monitoring and Reporting Technology ((SMART), Error Correction Code (ECC), TCG Pyrite, NVM Express (NVMe), 3D NAND Technology, S.M.A.R.T. (2)
• NVM Express (NVMe) (2)
• NVM Express (NVMe) 2.0, dynamic write acceleration, Multistep Data Integrity Algorithm, Adaptive Thermal Protection, power loss immunity, Active Garbage Collection, TRIM support, Error Correction Code (ECC), TCG Pyrite, S.M.A.R.T. (2)
• NVM Express (NVMe) 2.0b, Micron Secure Encrypted Environment (SEE), Self-Encrypting Drive (SED), Key-Based Firmware Update, Strong Asymmetric Key Support, Digitally Signed Firmware, Surprise Insertion capable, Surprise Removal capable, Hot-Plug Support, field-upgradeable firmware, Firmware Activate without Reset, NVMe Management Interface (NVMe-MI) 1.2b, Dynamic and Static Wear Leveling, NVME Urgent Weighted Round Robin, End-to-end data protection, Enterprise Power-Loss Protection, Read Unrecoverable Bit Error Rate (UBER) 10e-18, Open Compute Project 2.0, S.M.A.R.T. (2)
• Non-SED, 176-layer 3D NAND technology, Adaptive thermal monitoring, Enterprise Data Path Protection, Hot-Plug Support, RAIN technology, Read Intensive, power loss data protection (2)
• Non-SED, 176-layer 3D NAND technology, Adaptive thermal monitoring, Hot-Plug Support, RAIN technology, Read Intensive, power loss data protection (2)
• Non-SED, 176-layer 3D NAND technology, Asymmetric Roots of Trust, RSA Delegation Key Support, Secure Boot, Secure Execution Environment, Strong Asymmetric Key Support (2)
• Power loss data protection, Enterprise Data Path Protection, Firmware Upgrade without Reset, Secure Erase function, Secure Boot, Secure Firmware, Active Garbage Collection, TRIM support, Self-Encrypting Drive (SED), Digitally Signed Firmware, NAND Block Erase, Cryptographic Erase, DMA supported, 176-layer 3D TLC NAND technology (2)
• RAIN technology, Hot-Plug Support, power loss data protection, Thermal Monitoring, 176-layer 3D NAND technology (2)
• Single rank (2)
• Single rank, dual channel, unbuffered (2)
• 176-layer NAND technology, Adaptive thermal monitoring, Enterprise Data Path Protection, Hot-Plug Support, RAIN technology, Read Intensive, power loss data protection (1)
• 176-layer NAND technology, Adaptive thermal monitoring, Enterprise Data Path Protection, Hot-Plug Support, RAIN technology, power loss data protection, non-SED (1)
• 176-layer NAND technology, NVM Express (NVMe) (1)
• 3D NAND Technology, Multistep Data Integrity Algorithm, Thermal Monitoring, SLC Write Acceleration, Active Garbage Collection, TRIM support, Error Correction Code (ECC), upgradable firmware, S.M.A.R.T. (1)
• Black Mark sensor, tear bar (1)
• Dual rank, Intel Extreme Memory Profiles (XMP 3.0), AMD EXPO, unbuffered (1)
• Dynamic write acceleration, 3D NAND Technology, Microsoft eDrive compatible, power loss data protection, upgradable firmware, Redundant Array of Independent NAND, Multistep Data Integrity Algorithm, Adaptive Thermal Protection, Active Garbage Collection, TRIM support, Error Correction Code (ECC), Device Sleep support, S.M.A.R.T. (1)
• Gap sensor, paper near end sensor (1)
• Halogen Free, TRIM support, Error Correction Code (ECC), Multistep Data Integrity Algorithm, Active Garbage Collection, upgradable firmware, 3D NAND Technology, SLC Write Acceleration, Thermal Monitoring, S.M.A.R.T. (1)
• Integrated heatsink, 232-layer TLC NAND technology, Microsoft DirectStorage API support (1)
• Intel Extreme Memory Profiles (XMP 3.0), AMD EXPO, single rank, unbuffered (1)
• Intel Extreme Memory Profiles (XMP 3.0), AMD extended profiles for overclocking (EXPO), unbuffered (1)
• Microsoft DirectStorage API support, PlayStation compatible (1)
• NVM Express (NVMe) 1.4, 176-layer NAND technology, dynamic write acceleration, Host Memory Buffer (HMB), Secure Boot (1)
• Non-SED, 176-layer 3D NAND technology, Adaptive thermal monitoring, Enterprise Data Path Protection, Hot-Plug Support, RAIN technology, power loss data protection, Mixed-Use (1)
• Non-SED, 176-layer 3D NAND technology, RAIN technology, Hot-Plug Support, Thermal Monitoring, power loss data protection (1)
• PS5 compatible, 3D NAND Technology, dynamic write acceleration, Multistep Data Integrity Algorithm, TRIM support, Error Correction Code (ECC), TCG Pyrite, S.M.A.R.T. (1)
• Paper out sensor (1)
• Paper out sensor, open cover sensor, 11mm top margin, paper near end sensor (1)
• Paper out sensor, open cover sensor, paper low sensor, 11mm top margin (1)
• Power Loss Protection (PLP), NVM Express (NVMe) 1.4, 176-layer 3D TLC NAND technology (1)
• Quad rank, Load-Reduced (1)
• Shock-resistant (1)
• Single rank, eight banks, unbuffered (1)
• Single rank, four banks, registered (1)
• Tear bar (1)
• Wall mountable (1)